|Location||San Francisco Bay Area|
Design Engineer @ Apple Inc.
Packaging Engineer @ AMD
Electrical Integration Engineer @ Seagate Technology
Ph.D, Mechanical Engineering @ Carnegie Mellon University
B.S & M.S, Engineering Mechanics @ Tsinghua University
Background in: Heat transfer/thermal fluid, microscale heat transport in micro-electronic devices and systems; Electrical and magnetic transports in thin-film nanostructures for high-density magnetic recording applications. Specialties Extensive experience in developing various thermal/mechanical/fluid/electrical/optical characterization systems over relevant timescale of nanoseconds to steady-state in frequency and time domains and spatial resolution down to microns. Excellent instrumentation and programming skills see more