Yuanping Lee
Head of Quality Singapore Site, Director RF Frontend (RF360) at Qualcomm | Singapore, Singapore
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Yuan-ping Lee currently serves as the Head of Quality at Qualcomm’s Singapore Site and as Director of RF Frontend (RF360), where he leverages his extensive expertise to drive operational excellence and innovation within the semiconductor and wireless communication industries. In his leadership roles, Yuan-ping is instrumental in developing a high-performance organization rooted in a culture of transparency, safety, and continuous improvement. His strategic focus on fostering a safe space for idea exchange and knowledge sharing has catalyzed a robust environment for innovation, enabling his teams to consistently deliver first-time-right, error-free execution across complex manufacturing processes.
At Qualcomm, Yuan-ping spearheads initiatives aligned with Total Quality Management principles, emphasizing the continuum of Correct-Control-Improve-Prevent-Anticipate to enhance process robustness and systemic reliability. His expertise in applying methodologies such as L6S DMAIC, FMEA, and 8D has resulted in significant reductions in excursions and quality incidents, particularly in high-volume manufacturing environments for advanced nodes like 45nm and 65nm. His work in process convergence, defect reduction, and yield improvement has been pivotal in optimizing RF frontend modules and integrated circuit fabrication, ensuring product quality and customer satisfaction.
Yuan-ping’s comprehensive skill set encompasses process integration, backend development, and management within the semiconductor industry, with a focus on systemic process improvements like NMOS Vt modulation, interconnect RC delay reduction, and within-die uniformity enhancement. His leadership in developing a high-performance team and implementing best-in-class quality management systems—including rigorous audit and certification processes—continues to position Qualcomm at the forefront of innovation and operational excellence in RF and semiconductor manufacturing.
Head of Quality Singapore Site, Director RF Frontend (RF360) at Qualcomm in May 2023 to Present
Director, Quality and Reliability at GlobalFoundries in April 2021 to March 2023
Quality Director at GlobalFoundries in April 2017 to March 2021
Quality Deputy Director at GlobalFoundries in January 2013 to January 2017
Corporate Marketing Deputy Director at GlobalFoundries in January 2012 to January 2013
Process Integration Deputy Director at GlobalFoundries in January 2011 to January 2012
Process Integration Manager at Chartered Semiconductor in January 2008 to January 2011
Process Integration/Yield Enhancement Section Manager at Chartered Semiconductor in January 2004 to January 2008
Process Integration/Yield Enhancement Principal Engineer at Chartered Semiconductor in January 1998 to January 2004
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National University of Singapore, Master of Engineering (M.Eng.), July 1996 to July 1998
National University of Singapore, B. Eng. in Electrical Engineering (2nd Class Upper Honours), July 1992 to July 1996
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Process Improvement/Yield Enhancement/Program Management
130nm, 90nm Baseline Copper Process
65nm, 60nm, 55nm and 45nm Low Power Low-k Process
Management of several Engineering Teams
Organisational Development Leadership Program (ODLP) management program
65nm Wafer-Edge Yield Improvement
Awarded Best-In-Class for Successful and Rapid Development of 65nm Technologies
Prototyping/ramping to production/process improvements/yield enhancement
Process convergence/generic yield and defect improvements 45 and 65nm nodes
65nm and 45nm Low Power product tapeouts engagements
Process qualification/production rampp with Technology Development
Transistors and backend metal resistance/capacitance matching
Process/transistor matching by short-channel/narrow-width device improvements
STI reverse mask by using a High Selectivity Slurry during STI CMP
2-step W nucleation development/implementation to resolve fill marginality
Relation of Cu anneal time to CMP with grain growth/Photon-Assisted Cu Corrosion
Self-Aligned Local Interconnect Bitline-Bitline Bar (BL-BLB) cross talk
NMOS Vt modulating BL-BLB cross talk/leakage due to parasitic N-poly transistor
Local Interconnect-Poly/Vdd-Vss leakage/intra-well/parasitic field transistor
Cu CMP timelink to PEN deposition as cause for Metal Snake/Comb failures
Via-Stop-In-TiN for 0.18μm eliminates via fanging/incomplete barrier coverage
FSG HDP IMD backend of line development for improved interconnect RC delay
Metal reverse mask process to reduce within-die uniformity in backend IMD
Low-temperature/low Dep/Sputter ratio HDP for improved gapfill
High Density Plasma Inter-Metallic Dielectric for 0.35μm TiSi process
Yield
Engineering
Product Development
CMP
Process Improvement
Process Integration
CMOS
Management
Semiconductor Industry
Product Engineering
IC
Characterization
Semiconductors
Silicon
JMP
Microelectronics
Failure Analysis
RF
Integrated Circuits (IC)
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Discover more about QualcommWhat is Yuan-ping Lee email address?
Email Yuan-ping Lee at [email protected] and [email protected]. This email is the most updated Yuan-ping Lee's email found in 2026.
How to contact Yuan-ping Lee?
To contact Yuan-ping Lee send an email to [email protected] or [email protected]. (updated on March 09, 2025)
What company does Yuanping Lee work for?
Yuanping Lee works for Qualcomm
What is Yuanping Lee's role at Qualcomm?
Yuanping Lee is Head of Quality Singapore Site, Director RF Frontend (RF360)
What is Yuanping Lee's Phone Number?
Yuanping Lee's phone +44 ** **** *170
What industry does Yuanping Lee work in?
Yuanping Lee works in the Semiconductors industry.
Yuanping Lee Email Addresses
Yuanping Lee Phone Numbers
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