Max Hodek
Failure Analysis Engineer at Texas Instruments | Tucson, Arizona, United States
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Max Hodek is a dedicated Process Characterization Engineer at Texas Instruments, where he plays a pivotal role in advancing semiconductor technologies. With a strong foundation in Materials Science & Engineering, Max leverages his expertise to delve deep into the atomic-level intricacies of semiconductors, ensuring that TI remains at the forefront of innovation in this rapidly evolving industry. His passion for technology, sparked by building his first computer in high school, has translated into a career focused on enhancing semiconductor performance and reliability.
In his current role, Max is instrumental in the development and optimization of new semiconductor processes. He adeptly collects and analyzes materials characterization data, utilizing advanced techniques such as Focused Ion Beam (FIB) and Powder X-ray Diffraction to gain insights into material properties and behaviors. His primary tool, the FEI Metrios Transmission Electron Microscope (TEM), allows him to conduct high-resolution imaging and analysis, which is crucial for identifying and resolving process-related issues faced by internal customers.
Max's proficiency in Six Sigma methodologies ensures that he approaches problem-solving with a data-driven mindset, striving for continuous improvement in process efficiency and product quality. His skills extend beyond microscopy; he is well-versed in various characterization techniques, including Optical Microscopy, Dilatometry, and Charpy Impact Testing, which he employs to provide comprehensive evaluations of materials. By collaborating closely with cross-functional teams, Max not only enhances the understanding of semiconductor processes but also contributes to the successful implementation of innovative solutions that drive TI's mission forward.
Failure Analysis Engineer at Texas Instruments in June 2022 to Present
Process Characterization Engineer at Texas Instruments in January 2024 to January 2025
Next Generation Metals Intern at Boeing in May 2021 to August 2021
MSE 3021 Mechanical TA at Georgia Institute of Technology in January 2021 to May 2021
Quality Assurance Engineering Intern at CommScope in May 2020 to August 2020
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Georgia Institute of Technology, Bachelor of Science - BS, June 2026
UCLA, Master of Science in Engineering, June 2026
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Geometric Phase Analysis (GPA)
Cross Sections
Transmission Electron Microscopy (TEM)
Electron Energy Loss Spectroscopy (EELS)
Energy Dispersive X-ray Spectroscopy (EDS)
Photon Emission Microscopy (PEM)
Semiconductor Failure Analysis
Focused Ion Beam (FIB)
Powder X-ray Diffraction
Scanning Electron Microscopy (SEM)
Instron Tensile Testing
Six Sigma
LabVIEW
Matlab
Minitab
Microsoft Excel
Microsoft PowerPoint
Microsoft Word
Optical Microscopy
Oscilloscope
Digital Multimeter
Function Generator
Differential Scanning Calorimetry (DSC)
Thermogravimetric Analysis (TGA)
DMA
Dilatometry
Rockwell Hardness Tester
Charpy Impact Testing
Capillary Rheometer
Mechanical Polisher
Bend Testing
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Discover more about Texas InstrumentsWhat is Max Hodek email address?
Email Max Hodek at [email protected]. This email is the most updated Max Hodek's email found in 2026.
How to contact Max Hodek?
To contact Max Hodek send an email to [email protected]. (updated on September 03, 2024)
What company does Max Hodek work for?
Max Hodek works for Texas Instruments
What is Max Hodek's role at Texas Instruments?
Max Hodek is Failure Analysis Engineer
What is Max Hodek's Phone Number?
Max Hodek's phone (602) ***-*947
What industry does Max Hodek work in?
Max Hodek works in the Semiconductors industry.
Max Hodek Email Addresses
Max Hodek Phone Numbers
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