Heidi Ho
Engineering Intern @ Inventec Appliances Corp
IC Packaging Engineer
San Francisco Bay Area
Section title
Heidi Ho's Email Addresses & Phone Numbers
Heidi Ho's Work Experience
Inventec Appliances Corp
Engineering Intern
July 2010 to August 2010
Apple
IC Packaging Engineer
United States
Micron Technology
Sr. Engineer, IC Package Technology Integration
December 2014 to April 2017
United States
Broadcom Limited
IC Packaging Thermal Engineer
May 2011 to November 2014
Irvine, CA
Fluid Dynamic Lab, Mechanical Engineering, National Central University, Taiwan
Undergraduate Researcher in Bio-Fluid Dynamics
January 2008 to July 2009
Taiwan
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Frequently Asked Questions about Heidi Ho
What company does Heidi Ho work for?
Heidi Ho works for Inventec Appliances Corp
What is Heidi Ho's role at Inventec Appliances Corp?
Heidi Ho is Engineering Intern
What is Heidi Ho's personal email address?
Heidi Ho's personal email addresses are h****[email protected], and h****[email protected]
What is Heidi Ho's business email address?
Heidi Ho's business email addresses are not available
What is Heidi Ho's Phone Number?
Heidi Ho's phone (**) *** *** 413
What industry does Heidi Ho work in?
Heidi Ho works in the Electrical/Electronic Manufacturing industry.
Who are Heidi Ho's colleagues?
Heidi Ho's colleagues are danni hong, Andrea Simes, Adam Karonika, Nate Holbrook, Eric Petersen, Isaac Taylor, Simon Chan, Paisarn Charoenpornsawat, Shenghao Yang, and Suzie Schaefer
About Heidi Ho
🎓 Education
Heidi Ho is an experienced Mechanical Engineer who has a B.S. in Mechanical Engineering from National Central University in Taiwan. She then earned a M.S. in Mechanical Engineering from University of California, San Diego in 2011.Ho has worked in various engineering roles in the United States and her homeland of Taiwan. She has experience in mechanical engineering, software development, and project management.Ho is currently employed as a Mechanical Engineer in the United States. She has worked in various engineering roles in the United States and her homeland of Taiwan. She has experience in mechanical engineering, software development, and project management.
💡 Technical & Interpersonal Skills
Heidi Ho has a B.S. in Mechanical Engineering from the University of Colorado at Boulder, and a M.S. in Mechanical Engineering from the University of Texas at Austin. She has 5 years of experience in the field of mechanical engineering where she has worked as an IC Packaging Engineer at Apple in the United States, a Sr. Engineer, IC Package Technology Integration at Micron Technology in the US, and a Hybrid Memory Cube (HMC) & DDR4 3D Through-Silicon-Via (TSV) IC package development at Broadcom Limited. In her previous work, she has provided IC component level thermal analysis for package structure/material selection, built a continuum mathematical model for cartilage cell growth and migration in porous scaffolds, applied it to investigate cell growth and distribution under various concentrate seeding conditions, and enabled an efficient way of assessing cell-scaffold developments in vitro for tissue engineering applications.
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In a nutshell
Heidi Ho's Personality Type
Introversion (I), Sensing (S), Thinking (T), Perceiving (P)
Average Tenure
1 year(s), 11 month(s)
Heidi Ho's Willingness to Change Jobs
Unlikely
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