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Heidi Ho

Engineering Intern @ Inventec Appliances Corp

IC Packaging Engineer

San Francisco Bay Area

Ranked #993 out of 19,860 for Engineering Intern in United States

Section title

Heidi Ho's Email Addresses & Phone Numbers

Heidi Ho's Work Experience

Inventec Appliances Corp

Engineering Intern

July 2010 to August 2010

Apple

IC Packaging Engineer

United States

Micron Technology

Sr. Engineer, IC Package Technology Integration

December 2014 to April 2017

United States

Heidi Ho's Education

National Central University, Taiwan

B.S., Mechanical Engineering

2005 to 2009

University of California, San Diego

M.S., Mechanical Engineering

2009 to 2011

Heidi Ho's Professional Skills Radar Chart

Based on our findings, Heidi Ho is ...

Realistic
Impulsive
Thorough

What's on Heidi Ho's mind?

Based on our findings, Heidi Ho is ...

52% Left Brained
48% Right Brained

Heidi Ho's Estimated Salary Range

About Heidi Ho's Current Company

Inventec Appliances Corp

Thermal and Stress Simulation modeling for Cellular Phone Cases with SolidWork and HyperMesh

Frequently Asked Questions about Heidi Ho

What company does Heidi Ho work for?

Heidi Ho works for Inventec Appliances Corp


What is Heidi Ho's role at Inventec Appliances Corp?

Heidi Ho is Engineering Intern


What is Heidi Ho's personal email address?

Heidi Ho's personal email addresses are h****[email protected], and h****[email protected]


What is Heidi Ho's business email address?

Heidi Ho's business email addresses are not available


What is Heidi Ho's Phone Number?

Heidi Ho's phone (**) *** *** 413


What industry does Heidi Ho work in?

Heidi Ho works in the Electrical/Electronic Manufacturing industry.


About Heidi Ho

🎓 Education

Heidi Ho is an experienced Mechanical Engineer who has a B.S. in Mechanical Engineering from National Central University in Taiwan. She then earned a M.S. in Mechanical Engineering from University of California, San Diego in 2011.Ho has worked in various engineering roles in the United States and her homeland of Taiwan. She has experience in mechanical engineering, software development, and project management.Ho is currently employed as a Mechanical Engineer in the United States. She has worked in various engineering roles in the United States and her homeland of Taiwan. She has experience in mechanical engineering, software development, and project management.


💡 Technical & Interpersonal Skills

Heidi Ho has a B.S. in Mechanical Engineering from the University of Colorado at Boulder, and a M.S. in Mechanical Engineering from the University of Texas at Austin. She has 5 years of experience in the field of mechanical engineering where she has worked as an IC Packaging Engineer at Apple in the United States, a Sr. Engineer, IC Package Technology Integration at Micron Technology in the US, and a Hybrid Memory Cube (HMC) & DDR4 3D Through-Silicon-Via (TSV) IC package development at Broadcom Limited. In her previous work, she has provided IC component level thermal analysis for package structure/material selection, built a continuum mathematical model for cartilage cell growth and migration in porous scaffolds, applied it to investigate cell growth and distribution under various concentrate seeding conditions, and enabled an efficient way of assessing cell-scaffold developments in vitro for tissue engineering applications.


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In a nutshell

Heidi Ho's Personality Type

Introversion (I), Sensing (S), Thinking (T), Perceiving (P)

Average Tenure

1 year(s), 11 month(s)

Heidi Ho's Willingness to Change Jobs

Unlikely

Likely

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Heidi Ho's Social Media Links

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