Weng Tan
Senior Packaging Engineer at Semtech Corporation | San Jose, California, United States
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Weng Tan is a seasoned Senior Packaging Engineer at Semtech Corporation, bringing over 25 years of extensive experience in managing product and process introductions and transfers from pilot to high-volume manufacturing. With more than six years of hands-on experience in semiconductor assembly manufacturing operations, Weng has developed a robust expertise in advanced packaging technologies, particularly in the realm of Integrated Circuits (IC) and semiconductor products. His proficiency in English, Mandarin, and Malay enables him to effectively collaborate with global teams, fostering communication and innovation across diverse cultural backgrounds.
In his current role, Weng has spearheaded key projects that have significantly advanced the capabilities of Semtech’s product offerings. Notably, he has successfully developed and qualified a Land Grid Array (LGA) package with exceptionally low capacitance, measured in femtofarads, which is critical for high-performance applications. His innovative work with micro copper pillar C2 bumps in LGA and Quad Flat No-lead (QFN) packages for Transient Voltage Suppressor (TVS) products has set new benchmarks in the industry, enhancing the reliability and efficiency of power management solutions. Additionally, Weng has played a pivotal role in qualifying conductive die attach film (CDAF), further solidifying his expertise in semiconductor packaging technologies.
Weng’s commitment to excellence is evident in his results-driven approach, utilizing Statistical Process Control (SPC) methodologies to ensure the highest quality standards in semiconductor manufacturing. His deep understanding of CMOS and System on Chip (SoC) technologies positions him as a key player in the ongoing evolution of the semiconductor industry, where he continues to push the boundaries of innovation and efficiency.
Senior Packaging Engineer at Semtech Corporation in June 2013 to May 2023
Semiconductor Assembly & Product Packaging Engineer at FSL in April 2004 to November 2012
Equipment engineer, Assembly engineer, Product Packaging engineer at M in February 1991 to April 2004
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University of Malaya, Bachelor of Science (B.Sc.)
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IC
Semiconductor Industry
ASIC
Silicon
Semiconductors
SPC
CMOS
SoC
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Discover more about Semtech CorporationWhat is Weng Tan email address?
Email Weng Tan at [email protected]. This email is the most updated Weng Tan's email found in 2026.
What is Weng Tan phone number?
Weng Tan phone number is 7149961964 and 3237396143.
How to contact Weng Tan?
To contact Weng Tan send an email to [email protected]. If you want to call Weng Tan try calling on 7149961964 and 3237396143. (updated on August 25, 2024)
What company does Weng Tan work for?
Weng Tan works for Semtech Corporation
What is Weng Tan's role at Semtech Corporation?
Weng Tan is Senior Packaging Engineer
What industry does Weng Tan work in?
Weng Tan works in the Design industry.
Weng Tan Email Addresses
Weng Tan Phone Numbers
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