Morrie Lewin Email & Phone Number

Morrie Lewin

Package Layout Designer at Analog Devices | Grafton, Massachusetts, United States

Morrie Lewin Socials
About Morrie Lewin

Morrie Lewin is a seasoned Package Layout Designer at Analog Devices, where he leverages his extensive expertise in Printed Circuit Board (PCB) design to drive innovative solutions in the semiconductor industry. With a robust background that spans from single-sided DIP technology to complex double-sided multilayer Surface Mount technologies, Morrie has honed his skills in high-speed and RF design, adeptly managing constraints that reach up to 40 gigahertz. His current role involves extending his skill set into System-in-Package (SiP), System-on-Chip (SoC), Multi-Chip Module (MCM), and Flex packaging, positioning him at the forefront of emerging packaging technologies.

Morrie is actively engaged in key projects that aim to enhance the capabilities of the Packaging department in Wilmington, MA, and the Philippines. His commitment to innovation is evident as he prepares for the integration of new packaging technologies that will not only streamline processes but also improve product performance. His proficiency in Electronic Design Automation (EDA) tools, particularly Orcad, complements his deep understanding of manufacturing processes and power management, ensuring that designs are not only functional but also manufacturable.

In addition to his technical acumen, Morrie's collaborative spirit and problem-solving mindset enable him to tackle the unique challenges presented by modern electronic design. His experience with DDR2 and DDR3 technologies, along with his knowledge of ASIC design and scripting in Perl, equips him to contribute significantly to the advancement of Analog Devices' packaging initiatives. Morrie's enthusiasm for continuous learning and adaptation to new challenges makes him a valuable asset to his team and the broader semiconductor landscape.

Morrie Lewin Work
1 experience icon

Package Layout Designer at Analog Devices in November 2015 to Present

2 experience icon

Sr. PCB Designer at Analog Devices in January 2014 to October 2015

3 experience icon

Sr. PCB Designer at Teradyne in October 2013 to January 2014

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Morrie Lewin Education

Vermont Technical College, Associates, July 1976 to July 1978

University of Vermont, July 1975 to July 1976

Woodstock Union High School, July 1971 to July 1975

Morrie Lewin Skills

PCB design

Analog

Mixed Signal

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About Morrie Lewin's Current Company
Frequently Asked Questions about Morrie Lewin

What is Morrie Lewin email address?

Email Morrie Lewin at [email protected] and [email protected]. This email is the most updated Morrie Lewin's email found in 2026.

What is Morrie Lewin phone number?

Morrie Lewin phone number is 774-545-9792.

How to contact Morrie Lewin?

To contact Morrie Lewin send an email to [email protected] or [email protected]. If you want to call Morrie Lewin try calling on 774-545-9792. (updated on September 04, 2024)

What company does Morrie Lewin work for?

Morrie Lewin works for Analog Devices

What is Morrie Lewin's role at Analog Devices?

Morrie Lewin is Package Layout Designer

What industry does Morrie Lewin work in?

Morrie Lewin works in the Computer Hardware industry.

Morrie Lewin Email Addresses

Email Morrie Lewin at [email protected] and [email protected]. This email is the most updated Morrie Lewin's email found in 2026.

Morrie Lewin Phone Numbers

Morrie Lewin phone number is 774-545-9792.
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