Morrie Lewin
Package Layout Designer at Analog Devices | Grafton, Massachusetts, United States
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Morrie Lewin is a seasoned Package Layout Designer at Analog Devices, where he leverages his extensive expertise in Printed Circuit Board (PCB) design to drive innovative solutions in the semiconductor industry. With a robust background that spans from single-sided DIP technology to complex double-sided multilayer Surface Mount technologies, Morrie has honed his skills in high-speed and RF design, adeptly managing constraints that reach up to 40 gigahertz. His current role involves extending his skill set into System-in-Package (SiP), System-on-Chip (SoC), Multi-Chip Module (MCM), and Flex packaging, positioning him at the forefront of emerging packaging technologies.
Morrie is actively engaged in key projects that aim to enhance the capabilities of the Packaging department in Wilmington, MA, and the Philippines. His commitment to innovation is evident as he prepares for the integration of new packaging technologies that will not only streamline processes but also improve product performance. His proficiency in Electronic Design Automation (EDA) tools, particularly Orcad, complements his deep understanding of manufacturing processes and power management, ensuring that designs are not only functional but also manufacturable.
In addition to his technical acumen, Morrie's collaborative spirit and problem-solving mindset enable him to tackle the unique challenges presented by modern electronic design. His experience with DDR2 and DDR3 technologies, along with his knowledge of ASIC design and scripting in Perl, equips him to contribute significantly to the advancement of Analog Devices' packaging initiatives. Morrie's enthusiasm for continuous learning and adaptation to new challenges makes him a valuable asset to his team and the broader semiconductor landscape.
Package Layout Designer at Analog Devices in November 2015 to Present
Sr. PCB Designer at Analog Devices in January 2014 to October 2015
Sr. PCB Designer at Teradyne in October 2013 to January 2014
Sr. PCB Designer at Oracle/Sun Microsystems in May 2013 to May 2013
Sr. PCB Designer at Analog Devices Inc. in March 2003 to April 2013
Applications Engineer at Cadence Design Systems in January 1999 to January 2003
Sr. PCB Designer at Lucent Technologies in January 1997 to January 1999
Sr. PCB Designer at Hewlett Packard in January 1993 to January 1995
Sr. PCB Designer at Polaroid in January 1991 to January 1993
Sr. PCB Designer at Clearpoint Research Corporation in January 1987 to January 1991
PCB Designer at General Computer Company in January 1984 to January 1986
Technician at Charles River Data Systems in January 1981 to January 1984
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Vermont Technical College, Associates, July 1976 to July 1978
University of Vermont, July 1975 to July 1976
Woodstock Union High School, July 1971 to July 1975
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PCB design
Analog
Mixed Signal
Schematic Capture
Signal Integrity
EDA
Allegro
FPGA
Circuit Design
Orcad
Debugging
Manufacturing
Electronics
Cadence
Hardware Architecture
DFT
Power Management
DDR
Board Layout
Embedded Systems
DDR2
Electrical Engineering
ASIC
PADS
Semiconductors
Perl
DDR3
Design for Manufacturing
Altium Designer
PCB Design
OrCAD
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Discover more about Analog DevicesWhat is Morrie Lewin email address?
Email Morrie Lewin at [email protected] and [email protected]. This email is the most updated Morrie Lewin's email found in 2026.
What is Morrie Lewin phone number?
Morrie Lewin phone number is 774-545-9792.
How to contact Morrie Lewin?
To contact Morrie Lewin send an email to [email protected] or [email protected]. If you want to call Morrie Lewin try calling on 774-545-9792. (updated on September 04, 2024)
What company does Morrie Lewin work for?
Morrie Lewin works for Analog Devices
What is Morrie Lewin's role at Analog Devices?
Morrie Lewin is Package Layout Designer
What industry does Morrie Lewin work in?
Morrie Lewin works in the Computer Hardware industry.
Morrie Lewin Email Addresses
Morrie Lewin Phone Numbers
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