Minsu Lee

Minsu Lee, currently serving as the Director at the Korea Packaging Integration Association, plays a pivotal role in advancing Korea’s interconnection industry through strategic technology development and industry collaboration. In this capacity, Minsu leads initiatives that promote innovation in electronics packaging, semiconductor packaging, and interconnection technologies, aligning industry standards with emerging global trends. His expertise in materials science, polymers, and nanotechnology positions him at the forefront of developing next-generation packaging solutions that enhance performance, reliability, and miniaturization of electronic components.

A key focus of Minsu’s role involves facilitating government-funded R&D projects aimed at fostering sustainable growth and technological competitiveness within Korea’s electrical and electronic manufacturing sectors. He actively collaborates with industry stakeholders, research institutions, and government agencies to identify critical technological gaps and develop standardized protocols for electronic interconnection technology, including printed circuit board manufacturing and thin film coatings. His deep understanding of organic chemistry and coatings enables him to oversee the development of advanced materials that improve thermal management, electrical performance, and durability of electronic assemblies.

Moreover, Minsu’s leadership extends to organizing industry-wide workshops and standardization efforts that promote best practices in electronics packaging and semiconductor manufacturing. His comprehensive skill set—ranging from design of experiments to nanotechnology—enables him to drive innovative projects that push the boundaries of current technology. With a strong engineering background complemented by an MBA in Management from Rensselaer Polytechnic Institute, Minsu Lee is uniquely positioned to bridge technical excellence with strategic industry development, ensuring Korea remains a global leader in electronic interconnection and packaging solutions.