Max Lacey
IC Package Design Engineer II at Rochester Electronics, LLC | Greater Boston
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Max Lacey currently serves as an IC Package Design Engineer II at Rochester Electronics, LLC, where he leverages his extensive background in mechanical engineering to innovate and enhance semiconductor packaging solutions. With a Master’s degree in Mechanical Engineering, focusing on Robotics and Design and Manufacturing, Max possesses a unique blend of theoretical knowledge and practical experience. His role involves designing semiconductor packages that encompass critical elements such as housing and electrical connections. This includes detailed piece part design, mold tooling, and the creation of intricate electrical schematics, all of which are essential for ensuring the reliability and performance of electronic components.
Max is also actively engaged in the design, programming, and testing of robotic manufacturing equipment, showcasing his expertise in integrating robotics into manufacturing processes. His proficiency in software tools like AutoCAD and SolidWorks enables him to create precise designs and simulations, while his experience with JMP enhances his ability to analyze data and optimize manufacturing workflows. Beyond his technical skills, Max is dedicated to fostering talent within the engineering community. He takes pride in hiring, training, and mentoring interns and co-op students, helping to cultivate the next generation of engineers.
With a strong foundation in manufacturing processes and a keen understanding of design for manufacturing principles, Max is well-equipped to tackle complex engineering challenges. His commitment to excellence is further underscored by his DHS Security Clearance, allowing him to work on sensitive projects within the semiconductor industry. As a former Resident Advisor and community leader at UMass Lowell, Max also brings strong leadership and communication skills to his role, making him a valuable asset to Rochester Electronics and the broader engineering community.
IC Package Design Engineer II at Rochester Electronics, LLC in June 2021 to Present
Resident Advisor at University of Massachusetts Lowell in January 2019 to May 2020
Mechanical Engineering Co-op at Boston Engineering in January 2016 to July 2016
Mechanical Engineering Co-op at Lytron in January 2015 to July 2015
Mechanical Engineering Intern at Kleenline in April 2014 to August 2014
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University of Massachusetts Lowell, Master of Science - MS, September 2026
University of Massachusetts Lowell, Bachelor's degree, September 2026
Massachusetts Bay Community College, Associate degree, September 2026
Massachusetts Bay Community College, Associate degree, September 2026
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Manufacturing Process Improvement
Six Sigma
DHS Security Clearance
DoD Security Clearance
Education
Student Representative
Mentoring
SOLIDWORKS
Rapid Prototyping
Design for Manufacturing
Robotics
Mechanical Engineering
Process Control
Engineering
3D Printing
Drafting
Materials
3D Modeling
Manufacturing
PTC Creo
MATLAB
Prototyping
Microsoft Excel
Microsoft Office
AutoCAD
Leadership
German
Manufacturing Processes
Assembly Drawings
Fixtures
Mechanical Systems
Mechanisms
Computer-Aided Design (CAD)
Engineering Design
Quality Engineering
Mechanics
Process Manufacturing
Control Charts
Minitab
Customer Service
Fluid Mechanics
Test Fixtures
Machine Learning
English
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Discover more about Rochester Electronics, LLCWhat is Max Lacey email address?
Email Max Lacey at [email protected]. This email is the most updated Max Lacey's email found in 2026.
How to contact Max Lacey?
To contact Max Lacey send an email to [email protected]. (updated on September 06, 2024)
What company does Max Lacey work for?
Max Lacey works for Rochester Electronics, LLC
What is Max Lacey's role at Rochester Electronics, LLC?
Max Lacey is IC Package Design Engineer II
What is Max Lacey's Phone Number?
Max Lacey's phone (**) *** *** 187
What industry does Max Lacey work in?
Max Lacey works in the Mechanical Or Industrial Engineering industry.
Max Lacey Email Addresses
Max Lacey Phone Numbers
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