Mario Ciminelli
Photonics Packaging Engineer - R & D at Rochester Institute of Technology | Rochester, New York, United States
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Mario Ciminelli serves as a Photonics Packaging Engineer in Research and Development at the Rochester Institute of Technology, where he leverages his extensive mechanical engineering background to drive innovation in the packaging of photonic devices. His role is pivotal in advancing the AIM Photonics Initiative, a national effort aimed at establishing a robust ecosystem for the development and commercialization of integrated photonic technologies. Mario's expertise encompasses a wide array of engineering disciplines, including product development, manufacturing processes, and quality assurance, which he applies to create efficient and reliable packaging solutions for fiber and die attach.
In his current position, Mario is responsible for designing and optimizing packaging processes that enhance the performance and reliability of photonic devices. His work not only focuses on the technical aspects of packaging but also emphasizes the importance of materials selection and manufacturing methods, including injection molding and microelectronics integration. By utilizing Six Sigma methodologies, he ensures that the processes he develops meet stringent quality standards and are scalable for commercial production.
Mario's problem-solving skills are critical as he navigates the complexities of photonic device packaging, addressing challenges related to thermal management, mechanical stability, and environmental resilience. His contributions are instrumental in driving the commercialization of photonic technologies across various sectors, including consumer electronics, industrial automation, and automotive applications. Through his innovative approach and dedication to excellence, Mario Ciminelli continues to play a key role in shaping the future of photonics at the intersection of engineering and technology.
Photonics Packaging Engineer - R & D at Rochester Institute of Technology in January 2018 to Present
Program Manager at OLEDWorks LLC in January 2016 to January 2018
Sensor Reliability Engineer - Commercialization at Eastman Kodak Company in January 2014 to January 2016
Sr. Micro-Electronic Packaging Engineer at Eastman Kodak in January 2003 to January 2013
Sr. Design Engineer at Eastman Kodak in January 2000 to January 2003
Principal Engineer at Measurement Specialties, Inc in January 1998 to January 2000
Development Engineering Specialist at ABB Kent-Taylor in January 1983 to January 1993
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Rochester Institute of Technology, Bachelor of Science (B.S.)
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Design for Manufacturing
Product Development
Sensors
FMEA
MEMS
Solidworks
Manufacturing
Finite Element Analysis
Electronics Packaging
R&D
Six Sigma
Mechanical Engineering
Electronics
Design of Experiments
Microelectronics
Solid Modeling
Robust Design
Failure Analysis
Cross-functional Team Leadership
Engineering Management
Problem Solving
Pressure Sensors
Root Cause Analysis
Testing
Automation
SPC
Materials
Manufacturing Operations Management
Solid Mechanics
Image Sensors
Thick Film
Injection Molding
Product Design
Plastics
SolidWorks
Automotive
Reliability Engineering
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Discover more about Rochester Institute of TechnologyWhat is Mario Ciminelli email address?
Email Mario Ciminelli at [email protected] and [email protected]. This email is the most updated Mario Ciminelli's email found in 2026.
How to contact Mario Ciminelli?
To contact Mario Ciminelli send an email to [email protected] or [email protected]. (updated on August 27, 2024)
What company does Mario Ciminelli work for?
Mario Ciminelli works for Rochester Institute of Technology
What is Mario Ciminelli's role at Rochester Institute of Technology?
Mario Ciminelli is Photonics Packaging Engineer - R & D
What is Mario Ciminelli's Phone Number?
Mario Ciminelli's phone (212) ***-*898
What industry does Mario Ciminelli work in?
Mario Ciminelli works in the Electrical & Electronic Manufacturing industry.
Mario Ciminelli Email Addresses
Mario Ciminelli Phone Numbers
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