Eric Foronda
Packaging SI/PI Engineer at Qualcomm | San Diego County, California, United States
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Eric Foronda is a distinguished Packaging Signal Integrity (SI) and Power Integrity (PI) Engineer at Qualcomm, where he leverages over a decade of specialized experience in analog and mixed-signal integrity. His current role involves performing intricate simulation analyses of high-speed buses, which are critical for enabling customer designs and advancing platform development. Eric's expertise is particularly evident in his contributions to new package design optimization, where he has successfully taped out mobile, RF, and automotive packages, ensuring they meet the rigorous demands of modern technology.
One of Eric's notable achievements includes enabling PCIe Gen5 on advanced AU products, a significant milestone that underscores his proficiency in high-speed board design and electrical validation engineering. His meticulous approach to root cause analysis and debugging has been instrumental in facilitating the tape-out of numerous products, ensuring they are not only functional but also optimized for performance. Eric's commitment to detail and process optimization is reflected in his hands-on experience with simulation tools such as SPICE and Pspice, as well as his adeptness in circuit design, integrated circuit design, and PCB design.
In addition to his technical skills, Eric is a high-performance team-oriented leader. He excels in motivating, mentoring, and training his colleagues, fostering an environment of collaboration and innovation. His ability to bridge the gap between complex technical challenges and practical solutions makes him an invaluable asset to Qualcomm and the broader semiconductor industry. As he continues to push the boundaries of signal and power integrity, Eric remains dedicated to driving industry standards and innovations that shape the future of technology.
Packaging SI/PI Engineer at Qualcomm in August 2015 to Present
Signal Integrity Engineer/Analog Engineer at Intel in November 2009 to August 2015
Signal Integrity Engineer/Electrical Validation Engineer at Intel in November 2005 to November 2009
Hardware Failure Analysis Engineer at Sony in June 2004 to June 2005
Electrical Engineer at SAIC (Science Application International Corp) in September 2000 to June 2004
Student Aid at SupShip (Supervisor of Shipbuilding Conversion and Repair) in September 1998 to September 2000
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UC San Diego, Master's degree, August 2026
University of San Diego, Bachelor of Science (B.S.), August 1998 to August 2026
University of San Diego, Minor, August 1998 to August 2026
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USB
PCB design
Signal Integrity
Circuit Design
Simulations
Integrated Circuit Design
Cadence
Testing
SPICE
Pspice
Hardware
Power Supplies
Semiconductors
Allegro
System Architecture
Verilog
Solidworks
IC
Mixed Signal
SoC
ASIC
Debugging
PCIe
Agilent ADS
Processors
Hardware Architecture
Logic Analyzer
CMOS
Electronics
Electrical Engineering
Perl
PCB Design
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Discover more about QualcommWhat is Eric Foronda email address?
Email Eric Foronda at [email protected] and [email protected]. This email is the most updated Eric Foronda's email found in 2026.
How to contact Eric Foronda?
To contact Eric Foronda send an email to [email protected] or [email protected]. (updated on August 25, 2024)
What company does Eric Foronda work for?
Eric Foronda works for Qualcomm
What is Eric Foronda's role at Qualcomm?
Eric Foronda is Packaging SI/PI Engineer
What is Eric Foronda's Phone Number?
Eric Foronda's phone (213) ***-*408
What industry does Eric Foronda work in?
Eric Foronda works in the Semiconductors industry.
Eric Foronda Email Addresses
Eric Foronda Phone Numbers
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