Teardown.com

TechInsights' Teardown.com analyzes over 300 devices a year from mobile to medical, revealing deep insight into the technology and cost factors that influence product designs and related supply chains. With over 15 years experience, Teardown.com is the leader in providing technical insight, bill of material (BOM) costing and competitive intelligence to semiconductor, device manufacturer, systems, packaging, and costing professionals. Our comprehensive reports include: • Integrated circuit (IC) identification and classification • System architecture diagrams and photographs • Package and IC Die level verification of design wins • Component identification and measurement • Bill of materials cost estimates Custom teardown services are also available to meet your unique needs.