JCET Group

About JCET Group

JCET Group is a leading global semiconductor system integration packaging and test provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world.

Our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive and industry etc., through advanced wafer level packaging, 2.5D/3D, System-in-Packaging, and reliable flip chip and wire bonding technologies. JCET Group has three R&D centers, six manufacturing locations in China, Singapore and Korea, and sales centers around the world, providing close technology collaboration and efficient supply-chain manufacturing to customers in China and around the world.

Website	http://www.jcetglobal.com
Employees	11-50 employees View all JCET Group employees
Industry	Semiconductors
Location	锦绣东路2777弄 Lane 2777, Jinxiu East Road, 29, 浦东新区 Pudong New Area, 上海 Shanghai 201206, CN
Founded	1972
Keywords	Wafer Bumping, Wafer Level Packaging, Semiconductor Test, System-In-Package, Flip Chip Packaging, Semiconductor Package Assembly