About Six Sigma
The alteration and testing of microelectronic components to increase reliability, mitigate tin whiskers, or achieve RoHS compliance.
Services include: robotic hot solder dip, column attach, ball grid array (BGA) to column grid array (CGA) conversions, ball attach, BGA reballing, and trim & form.
Testing includes:
solderability, fine & gross leak, bond pull, ball shear, XRF, failure analysis, and mark permanency.
Products include BGA preforms for ball attach or reballing.
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11-50 employees
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Semiconductors
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905 Montague Expy, Milpitas, California 95035, US
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Frequently Asked Questions about Six Sigma
Rose-h Oyourou-n'guessan is the CEO of Six Sigma. To contact Rose-h Oyourou-n'guessan email at [email protected].
The decision makers in Six Sigma are Ayman Sejiny, Christian Gane, Farrukh Faiz, etc. Click to Find Six Sigma decision makers emails.
Six Sigma Staff Directory
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