About Six Sigma

Website
Website
Employees
Employees
51-200 employees View all
Industry
Industry
semiconductors
Location
Location
US
Description
Information
The alteration and testing of microelectronic components to increase reliability, mitigate tin whiskers, or achieve RoHS compliance. Services include: robotic hot solder dip, column attach, ball grid array (BGA) to column grid array (CGA) conversions, ball attach, BGA reballing, and trim & form. Testing includes: solderability, fine & gross leak, bond pull, ball shear, XRF, failure analysis, and mark permanency. Products include BGA preforms for ball attach or reballing.

Six Sigma Alternatives

Industry
publishing
Industry
Semiconductors
Industry
Semiconductors
Industry
semiconductors
Industry
semiconductors
Industry
semiconductors
Industry
semiconductors

Frequently Asked Questions about Six Sigma

What is Six Sigma email format?

The widely used Six Sigma email format is {f}{last} (e.g. [email protected]) with 75.00% adoption across the company.


What is Six Sigma customer service number?

To contact Six Sigma customer service number in your country click here to find.


Supercharge your
Prospecting &
Outreach with
ContactOut
Supercharge your Prospecting &
Outreach with ContactOut

Search Portal

Find countless prospects outside of LinkedIn fast

Accelerate prospecting with instant access to 300M professionals from 30M companies with the right contact details.

Discover the source of our data

Learn more