Palomar Technologies makes the connected world possible by delivering a Total Process Solution™ for advanced photonic and microelectronic device packages utilized in today’s smart, connected devices. With a focus on flexibly, Palomar’s Total Process Solution includes Palomar die attach bonders, Palomar wire and wedge bonders, SST vacuum reflow systems, along with its Innovation Centers for outsourced manufacturing, and assembly, and Customer Support services that together, deliver improved production quality and yield, reduced assembly times and rapid ROI.
With over 40 years of deep industry expertise, Palomar equips customers to become leaders in the development of complex, digital technologies that are the foundation of the connected world and the transmission of data generated by billions of connected devices. Palomar solutions are utilized by the world’s leading companies providing solutions for datacom, 5G, electric vehicle power modules, autonomous vehicles/LiDAR, enhanced mobile broadband, Internet of Things, SMART technology, and mission critical services.
Headquartered in Carlsbad, California, Palomar offers global sales, service and application support from its offices in the USA, Germany, Singapore and China. For more information, visit: http://www.palomartechnologies.com
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51-200 employees
View all Palomar Technologies employees
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Semiconductors
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6305 El Camino Real, Carlsbad, CA 92009, US
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1995
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Itar Compliance, Photonics, Class 1000-10000 Clean Labs, Comprehensive Bonder Training, Contract Assembly Services, High-Accuracy Die Attach, High-Rel Wire Bonding, Microelectronic Packaging, Optoelectronic Packaging, Precision Assembly Systems, Process Development Consulting, Photonic Packaging, Die Bonding, Vacuum Reflow, Wire Bonding
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Bruce H is the CEO of Palomar Technologies. To contact Bruce H email at [email protected].
The decision makers in Palomar Technologies are Allan Hass, Bruce H, Chan, etc. Click to Find Palomar Technologies decision makers emails.
Palomar Technologies serves a variety of industries including telecommunications, aerospace, defense, medical devices, and consumer electronics. Our solutions are tailored to meet the specific needs of these sectors, particularly in the areas of photonic and microelectronic device packaging.
The Total Process Solution™ is an integrated approach that encompasses all aspects of photonic and microelectronic packaging. This includes high-accuracy die attach, wire bonding, and comprehensive training programs. Our goal is to provide clients with a seamless experience from initial design to final assembly, ensuring high reliability and performance in their devices.
Palomar Technologies adheres to strict ITAR (International Traffic in Arms Regulations) compliance protocols by implementing secure processes and controls for handling sensitive technologies. Our facilities are designed to meet ITAR requirements, and our staff undergoes regular training to ensure compliance with all relevant regulations.
Palomar Technologies offers comprehensive bonder training programs that cover both theoretical and practical aspects of bonding technologies. Our training includes hands-on sessions with our precision assembly systems, ensuring that operators are well-equipped to achieve optimal results in microelectronic and photonic packaging.
Yes, Palomar Technologies provides process development consulting services to help clients optimize their packaging processes. Our experienced team works closely with clients to identify challenges and develop tailored solutions that enhance efficiency, reduce costs, and improve product quality.
Palomar Technologies specializes in high-rel wire bonding, vacuum reflow, and precision die bonding for both microelectronic and optoelectronic packaging. Our advanced technologies and cleanroom environments (Class 1000-10000) ensure that we meet the stringent requirements of modern electronic devices, delivering high-performance and reliable packaging solutions.
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