Amm H
Senior Module Development Engineer, Substrate Packaging Technology Development at Intel Corporation | Chandler, Arizona, United States
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Amm H. is a seasoned Senior Module Development Engineer at Intel Corporation, where he leverages over seven years of diverse experience in the semiconductor industry to drive innovation in substrate packaging. His current role focuses on the Pathfinding and Module Engineering roadmap execution, where he plays a pivotal part in advancing glass structuring and patterning technologies. Amm is at the forefront of developing cutting-edge laser-assisted etching techniques, which are essential for creating next-generation high-performance die packaging substrates tailored for high-speed I/O and AI applications.
His expertise in process capability, overall equipment effectiveness (OEE), and statistical process control (SPC) enables him to optimize production processes and enhance product quality. Amm's proficiency in materials such as metals, polymers, and composites allows him to tackle complex engineering challenges, ensuring that the substrates meet the rigorous demands of modern computing technologies. As a dynamic engineering lead and technical project manager, he excels in orchestrating interdisciplinary teams, effectively bridging the gap between internal stakeholders and external partners. His adeptness in program management and new product introduction (NPI) management ensures that projects are executed on time and within budget, while his knowledge of design for assembly principles contributes to streamlined manufacturing processes.
Amm's contributions are not only technical but also strategic, as he continually seeks to align project goals with Intel's broader vision of innovation in semiconductor technology. His commitment to excellence and collaboration positions him as a key player in Intel's mission to redefine the future of computing.
Senior Module Development Engineer, Substrate Packaging Technology Development at Intel Corporation in August 2022 to Present
Research Associate, Advanced Materials and Nano-manufacturing Lab at Arizona State University in May 2019 to August 2022
Subject Matter Expert- Surface Finishing (Color, Material, Finish), Manufacturing Design at Apple in June 2018 to January 2019
Planning, Maintenance & Ops Strategy Engineer at Freeport-McMoRan in May 2017 to August 2017
Plant Engineer, Power plant operations and process at Abengoa in January 2015 to September 2015
Manufacturing Process & Quality Engineer- Assembly and Finish, Operations at Apex Tool Group LLC in August 2014 to January 2015
Technical Trainer, Packaging, Secondary Manufacturing Department, Operations (Supply Chain) at BAT in September 2010 to August 2011
Team Leader- Manufacturing, Operations (Supply Chain) at BAT in September 2008 to August 2010
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Arizona State University, Doctor of Philosophy (PhD), August 2026
University of North Texas, Master of Science (MSc)
Bangladesh University of Engineering and Technology, Bachelor of Science (BSc)
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Assembly integration
Stamping
Cosmetic surface finish
Sealing
Color Management
Plastic Extrusion
3D printing
Extrusion
Attention to Detail
Process Capability
OEE
Cycle Time Reduction
SPC
People Management
Resource Management
Cost Management
Performance Management
5S
Kaizen
Lean Six Sigma
Total Quality Management (TQM)
Poka Yoke
Manufacturing auto
Packaging Engineering
Six-Spider arm Robotic Operation and alignment
Metal Injection Molding
Heat Treatment
Annealing
Sandblasting
Tumbling
Chrome Plating
Coating
Design for Assembly
Gage R&R
Geometric Dimensioning & Tolerancing
CMM
Hardness measurement
Quality Control Inspection
Quality Management
ISO 9001
Mentoring & Coaching of operators
Data Interpretation, and Plant performance analysis
Emission monitoring
Solar Salt based Thermal Energy Storage
HAZOPER
Failure Mode and Effects Analysis (FMEA)
Pareto Analysis
Strategic Planning
Operations Research
SAP
Anodizing
Mechanical and chemical surface finishing
Color matching and uniformity, retention and stability measurement
Surface characterization using confocal Raman
Laser drilling recipe creation from the DXF and ODB design file
Optical metrology analysis
Materials Characterization
Program Management
JMP
SQL
NPI Management
Product Development
Materials design
Color Material Finish
Glass materials
Laser Glass interaction
Additive Manufacturing
Advanced Semiconductor Packaging
Rheology
Metal, Polymers and Composites
Laser and Optics
Process Engineering
Manufacturing
R&D
Project Management
Leadership
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Discover more about Intel CorporationWhat is Amm H email address?
Email Amm H at [email protected] and [email protected]. This email is the most updated Amm H's email found in 2026.
How to contact Amm H?
To contact Amm H send an email to [email protected] or [email protected]. (updated on February 02, 2025)
What company does Amm H work for?
Amm H works for Intel Corporation
What is Amm H's role at Intel Corporation?
Amm H is Senior Module Development Engineer, Substrate Packaging Technology Development
What is Amm H's Phone Number?
Amm H's phone (602) ***-*401
What industry does Amm H work in?
Amm H works in the Consumer Electronics industry.
Amm H Email Addresses
Amm H Phone Numbers
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