Weng Yap

Q: What is Weng Yap email address?

Email Weng Yap at foong_14@yahoo.com and weng.yap@nxp.com. This email is the most updated Weng Yap email found in 2026.

Q: How to contact Weng Yap?

To contact Weng Yap send an email to foong_14@yahoo.com or weng.yap@nxp.com. If you want to call Weng Yap try calling on +14808144071. (updated on October 30, 2024)

Principal Hardware Engineer at NXP Semiconductor at NXP Semiconductors | Chandler, Arizona, United States

About Weng Yap

Weng Yap is a Principal Hardware Engineer at NXP Semiconductors, where he leverages his extensive expertise in semiconductor IC packaging and hardware development to drive innovation and efficiency across multiple global test centers. With a strong foundation in various packaging technologies, including Fan-Out Wafer Level Packaging (FOWLP), Wafer Level Chip Scale Packaging (WLCSP), Flip-Chip, Ball Grid Array (BGA), and lead-frame packages, Weng plays a pivotal role in the new product and technology introduction processes. His current projects involve the development of Automated Test Equipment (ATE) hardware for NPI Test Centers located in Chandler, Bangkok, Malaysia, Tianjin, and Kaohsiung, ensuring that the latest semiconductor technologies are rigorously tested and validated.

Weng's proficiency in reliability testing is exemplified by his work on bias schematics and coding for High-Temperature Operating Life (HTOL), burn-in, and Temperature-Humidity-Bias (THB) tests. As a total quality champion for Global Hardware Solutions, he meticulously tracks and reports key quality metrics such as First Time Right (FTR) and On Time Delivery (OTD), driving continuous improvement initiatives across the organization. His Six Sigma Black Belt certification underscores his commitment to quality and efficiency, having successfully saved over $6 million through various Six Sigma projects.

In addition to his technical acumen, Weng is adept in statistical analysis tools, including Excel, JMP, and Minitab, which he utilizes to conduct Failure Mode and Effects Analysis (FMEA) and Design of Experiments (DOE). His ability to coordinate complex projects and implement Lean Manufacturing principles further enhances his contributions to NXP Semiconductors, making him a valuable asset in the fast-paced semiconductor industry.

Weng Yap Work

Principal Hardware Engineer at NXP Semiconductor at NXP Semiconductors in February 2017 to Present

Senior Package Development Engineer at Freescale Semiconductor in January 2012 to February 2017

Process Development Engineer at Freescale Semiconductor in May 2009 to December 2011

Weng Yap Skills

Failure Analysis

FMEA

Six Sigma

About Weng Yap's Current Company

NXP Semiconductors

Discover more about NXP Semiconductors

Frequently Asked Questions about Weng Yap

What is Weng Yap email address?

Email Weng Yap at [email protected] and [email protected]. This email is the most updated Weng Yap email found in 2026.

What is Weng Yap phone number?

Weng Yap phone number is +14808144071.

How to contact Weng Yap?

To contact Weng Yap send an email to [email protected] or [email protected]. If you want to call Weng Yap try calling on +14808144071. (updated on October 30, 2024)

What company does Weng Yap work for?

Weng Yap works for NXP Semiconductors

What is Weng Yap's role at NXP Semiconductors?

Weng Yap is Principal Hardware Engineer at NXP Semiconductor

What industry does Weng Yap work in?

Weng Yap works in the Semiconductor Manufacturing industry.