Sundar Rajarajan
Principal Engineer - Cell Integration at Micron Technology | San Francisco Bay Area
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Sundar Rajarajan serves as a Principal Engineer in Cell Integration at Micron Technology, where he leverages his extensive experience in device and process integration to drive innovation in memory technology. With a robust background in electrical engineering and a solid foundation in product engineering, Sundar excels in bridging the gap between design, process, testing, and product development. His current role involves spearheading the process roadmap strategy for the timely qualification of the 2nd Generation 3DXP technology, a critical advancement in the realm of 3D memory architectures.
In his capacity, Sundar has led numerous high-impact projects that focus on accelerating cell development through meticulous experimentation and yield optimization. He has a proven track record of segmenting and sourcing yield failures to specific processes, testing methodologies, algorithms, and design parameters. By employing advanced data analysis techniques and statistical process control (SPC), he identifies root causes of yield issues and implements effective solutions to enhance manufacturing efficiency and product reliability.
Sundar's expertise extends to technology transfer and failure analysis, where he utilizes programming languages such as MATLAB, C, and Perl to develop novel solutions that streamline processes and improve product performance. His proficiency in JMP scripting further enables him to conduct in-depth data analysis, facilitating informed decision-making and fostering a culture of continuous improvement within the organization. As a passionate advocate for innovation, Sundar is dedicated to pushing the boundaries of memory technology, ensuring that Micron remains at the forefront of the industry.
Principal Engineer - Cell Integration at Micron Technology in September 2018 to Present
Senior Engineer - Cell Integration (2nd Gen 3DXPoint) at IM Flash in September 2017 to August 2018
Engineer III - Process Integration (1st Gen 3DXPoint Bitline Module Owner) at IM Flash in September 2016 to August 2017
Engineer II - Process Integration (1st Gen 3DXPoint Wordline Module Owner) at IM Flash in July 2015 to August 2016
Graduate Research Assistant (Scanning Tunneling Microscopy Group) at University of Illinois Urbana-Champaign in August 2013 to May 2015
System Hardware Engineering Intern (Chip Solution) at NVIDIA in January 2013 to May 2013
Product Engineering Intern (NOR Flash) at Micron Technology in June 2012 to August 2012
Product Engineering Intern (NOR Flash) at Micron Technology in June 2011 to December 2011
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Semiconductor Device
Device Physics
Process Integration
Design of Experiments (DOE)
Nanomaterials
Technology Transfer
Failure Analysis
Data Analysis
MATLAB
C
Perl
Tableau
JMP Scripting Language
JMP
AFM
Raman Spectroscopy
Flash Memory
Semiconductor Process
New Product Introduction
Statistical Process Control (SPC)
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Discover more about Micron TechnologyWhat is Sundar Rajarajan email address?
Email Sundar Rajarajan at [email protected]. This email is the most updated Sundar Rajarajan email found in 2026.
How to contact Sundar Rajarajan?
To contact Sundar Rajarajan send an email to [email protected]. (updated on November 04, 2024)
What company does Sundar Rajarajan work for?
Sundar Rajarajan works for Micron Technology
What is Sundar Rajarajan's role at Micron Technology?
Sundar Rajarajan is Principal Engineer - Cell Integration
What is Sundar Rajarajan's Phone Number?
Sundar Rajarajan's phone (**) *** *** 296
What industry does Sundar Rajarajan work in?
Sundar Rajarajan works in the Semiconductor Manufacturing industry.
Sundar Rajarajan Email Addresses
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