Task Microelectronics USA

Provider of innovative microelectronics solutions for over 20 years• Our engineers combine assembly technologies to miniaturize your designs;• Assembly substrates: Ceramic, aluminum nitride, rigid PCB, flex PCB, polyimide, Teflon;• Assembly technologies: Surface mount, through-hole, chip & wire, flip-chip;• Assembly combinations: Chip stacking, chip on chip, chip on PCB (rigid or flex), flex onceramic, SMT & chip/wire on ceramic, etc.• Locations in Montreal, Canada and Portsmouth, New Hampshire;• Privately owned;• Serving the military, medical and industrial sectors;• ISO 9001-2000 registration;• ITAR compliance;