NEPES Corp.

nepes corporation, founded in 1990, has been providing bumping and wafer-level package OSAT manufacturing services in partnership with Fabless and IDM customers worldwide since 2001.nepes offers turn-key solution of IC backend service for 8″ and 12″ wafer with reliable quality by implementing mainstream technology from the wafer bumping, IC packaging and testing. The Company’s portfolio of products covers wafer level package (WLP), fan-out wafer level package (FO-WLP), fan-out wafer level system in package (FOWL-SiP) and PLP(Panel Level Package) which is a hybrid package manufacturing technology that has revolutionized the mass production experience of advanced semiconductor packaging with the touch screen panel (TSP) production line for LCD. nepes has manufacturing sites in South Korea and China and international sales offices in San Diego, CA and Shanghai, China.