About FlipChip International

Website
Website
Employees
Employees
51-200 employees View all
Industry
Industry
semiconductors
Location
Location
3701 E University,Phoenix,Arizona,US
Description
Information
FlipChip International (FCI) supplies turnkey semiconductor assembly and test services to the consumer, automotive, aerospace and medical industries through our leadership in high volume wafer level packaging and advanced packaging technologies. FCI was an early developer of Wafer-Level Chip Scale Packaging and remains the technology leader in this field with many patented technologies spanning from Cu Pillar Bumping, Spheron™ WLCSP, ChipsetT™ Embedded Die Packaging, and FlipChip on Leadframe assembly. FCI supports a wide range of customers from each industry, frequently partnering with them to engineer customized solutions. FCI has a global footprint, offering high volume advanced packaging services from ISO/TS 16949-certified factories located in Phoenix, Arizona, USA, and Shanghai, China

FlipChip International Alternatives

Industry
semiconductors
Industry
semiconductors
Industry
semiconductors
Industry
semiconductors
Industry
semiconductors
Industry
Semiconductors
Industry
semiconductors

Frequently Asked Questions about FlipChip International

What is FlipChip International email format?

The widely used FlipChip International email format is {first}.{last} (e.g. [email protected]) with 81.82% adoption across the company.


What is FlipChip International customer service number?

To contact FlipChip International customer service number in your country click here to find.


Who is the CEO of FlipChip International?

Bob Forcier is the CEO of FlipChip International. Or you may call (602) 431-4701


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