Electronic and Assembly Material Solutions

H.B. Fuller’s comprehensive adhesive solutions for electronics at all levels combine the knowledge of our performance products and the operating dynamics of the Electronics and Assembly industries. Our performance bonding adhesives, sealants, surface mount, underfills, potting & encapsulation and conformal coatings are based on a broad range of chemistries. These bespoke formulations are specifically designed to deliver optimum performance in a range of demanding electronics applications, where wide operating temperatures and harsh environments mean a tailored solution is required.H.B. Fuller understands the dynamics of the electronics industry. The industry participates in a global supply chain environment where products are often designed in one part of the world and assembled in another. This requires a support structure that can provide knowledge and expertise whenever you need it. We provide strong support and service not only on the development and deployment of electronics systems, but also on the equipment infrastructure and process related details. Our newly established global electronics and materials manufacturing facilities in China provide us reliable, competitive advantages to grow the business together with our customers around the world.