COC&Die/Wire Bond Technology and Products
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About COC&Die/Wire Bond Technology and Products
TFC's ability in Box Packaging:High Precision Die BondingHigh Density and Precision Gold Wire BondingHigh Resolution 3D Visual Image Automatic CouplingDesign and Manufacture for Parallel optics ProductAssembly of Free Space Isolator and Bonding with Receptacle
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1,001-5,000 employees
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Telecommunications
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2005
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