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1,001-5,000 employees
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Telecommunications
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TFC's ability in Box Packaging:High Precision Die BondingHigh Density and Precision Gold Wire BondingHigh Resolution 3D Visual Image Automatic CouplingDesign and Manufacture for Parallel optics ProductAssembly of Free Space Isolator and Bonding with Receptacle
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COC&Die/Wire Bond Technology and Products Email Formats | Example Email Formats | Percentage |
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{first}.{last} | [email protected] |
75%
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The widely used COC&Die/Wire Bond Technology and Products email format is {first}.{last} (e.g. [email protected]) with 75% adoption across the company.
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