Alltemated Inc.

Since 1993, Alltemated Inc. has been a leader in the Electronics Manufacturing and Value-Add service industries. We are an OEM of carrier tapes and our disruptive technology PLACE-N-BOND Underfilm. Alltemated is an ISO 9001:2015 registered company located just outside of Chicago,IL. Our staff engineers the most efficient and effective methods for Value-Add services. Our Value-Add services include IC Programming, Tape and Reel, Laser Marking/Ablation, Thermoforming and other Assembly Services. Alltemated Inc. designs and manufactures standard size and custom carrier tapes and the underfill alternative, PLACE-N-BOND Underfilm. PLACE-N-BOND Underfilm, sets us apart in the Consumer Electronics and OEM markets. This trademarked technology uses pre-formed thermoplastic to edge-bond BGA/CSP/LGA and other packages to the PCB. This helps to improve solder ball/joint reliability, without the need to dispense from a syringe like traditional underfills and adhesives. Pick and Place the exact amount of adhesive precisely where YOU need it with PLACE-N-BOND Underfilm.