An experienced engineering manager with a successful career leading the design and development of custom products for the computer, telecom, and datacom industries. Highly self-motivated, capable of leading teams, effectively communicating and building consensus among engineers, factory personnel, management, and customers. Unique combination of experience from fast paced start-up environments to large, multi-national organizations. Recognized for development of complex engineering projects, team development, leadership, conflict resolution and project management. Demonstrated success in all aspects of electro-mechanical engineering from product definition, conceptual design, detailed design, analysis, qualification, and production. Extensive experience in transferring designs into high-volume, low-cost, Asian manufacturing locations. CORE COMPETENCIES: Engineering Management Product Development | Project Management | 3D Solid Modeling (ProE/Creo Elements/Solidworks) | Statistical Tolerance Analysis | Computational Fluid Dynamics Analysis (CFD: ANSYS Icepak) | Thermal Design & Analysis | Airflow and Thermal Testing & Validation

Technical Manager @ Founded in 1975, Lite-On Technology is the world’s leading manufacturer of electronic devices and optoelectronic components with sales and production facilities in Asia, Europe and the Americas with annual revenue exceeding $7 billion USD. The Power System Solutions business unit is developing leading edge technology in the power system infrastructure for Data Centers. Opened the first US based design center for the Power System Solutions Business Unit in Plano Texas. Selected and built a multi-disciplined engineering team to develop several key products in Liteon’s product portfolio. Technical leader for all US based engineering activities and co-developed products with satellite design centers located in Taiwan. Directed the development of products targeting hyperscale computing customers following the Open Compute Project (OCP) in the US and Project Scorpio in Asia. From August 2014 to Present (1 year 3 months) Plano, TxSr. Mechanical Engineering Manager @ Technical leader responsible for the mechanical and thermal development of AC/DC rectifiers for the server and storage market. Served as primary technical interface for key customer accounts to gain understanding of technical challenges and provide solutions for next generation products. Architected platform designs and successfully transferred them to satellite design centers for product portfolio expansion. ► Simultaneously led the mechanical & thermal development and drove the overall cross-functional engineering development of Flextronics’ flagship server power program, a high density 40 W/in3, 1600W Platinum Efficient power supply. Managed the customer interface, detailed design and development, program schedule, issue resolution & closure, safety certification, and new product introduction to the factory. Coordinated engineering efforts across multiple global design centers and factory locations. Product is currently in mass production and has been leveraged into 14 other server power products generating multiple new lines of business. ► Proactively assumed the responsibility of managing the design and development of a 750W power for a key customer account. Directed the efforts of the engineering team consisting of electrical, mechanical, firmware, PCB layout, and test engineers. Managed the project schedule balancing the requirements of the customer, R&D, and factory teams resulting in a successful product launch, on time, and below cost targets. From November 2010 to July 2014 (3 years 9 months) Plano, TxSenior Staff Mechanical Engineer @ Engineering lead responsible for the mechanical and thermal development of power products for the enterprise server and storage markets. Successfully transferred and integrated Coldwatt products and technology into Flextronics portfolio. Trained engineering staff in satellite design centers on advanced packaging techniques, thermal design/cooling strategies, and engineering best-practices. ► Led the successful mechanical/thermal, design & analysis, and product launch of 4 power supplies ranging from 500-1600W that were leveraged into multiple products generating new business and new client bases. ► Developed design architectures and packaging solutions for cooling high power, small form factor power electronics through conduction and forced convection strategies. From August 2008 to November 2010 (2 years 4 months) Plano, TxSr. Mechanical Engineer @ Technical lead for a team of 8 mechanical engineers for an early-stage startup-company tasked with the rapid commercialization of Rockwell Scientific’s IP in the area of power electronics. Developed product architecture and mechanical/thermal design for Coldwatt’s initial products. Supervised the design and analysis of follow-on products as product line expanded. ► First mechanical engineer hired and helped select, hire, and grow the mechanical engineering team to 8 engineers across 3 design centers. ► Designed and developed the mechanical and thermal solutions for Coldwatt’s first product, a 650W server power supply that achieved Gold level efficiency for a large tier-one customer. This product was leveraged into 6 other products that provided Coldwatt’s main revenue stream. ► Generated and presented technical proposals for two new products for a new client’s next-generation server that was successfully awarded. This business award eventually led to Coldwatt’s acquisition by Flextronics. From September 2004 to August 2008 (4 years) Plano, TxSr. Mechanical Engineer @ Engineering lead tasked with the design, support, and documentation for all of Inet’s portable and rack mount Network Monitoring equipment in a high volume, time sensitive, production environment. Development included PCB, thermal and mechanical design along with design verification testing and manufacturing support. Lead the Document Control Team to ensure proper engineering documentation to meet ISO standards. ► Designed and developed a new high speed, carrier grade, hardware platform to meet the Advanced Telecom Computing Architecture, ATCA®, PICMG 3.X specification. ► Developed new printed circuit boards and custom front panels for a 24-slot mid-plane designed chassis. ► Developed a custom cooling solution for a high thermal output processor. Design included a combination heatsink/fan and a custom mounting solution. From January 2004 to September 2004 (9 months) Richardson, TxSr. Mechanical Engineer @ Responsible for the overall mechanical design and development of the Line Rack Subsystem and all system level equipment for a large, carrier class, optical router. Early participation included product definition, feasibility studies, system requirements, and system layout for a 36 rack, central office system. ► Designed custom mid-plane shelf and backplane assembly that interconnected 32 front accessed and 18 rear accessed modules. ► Designed fiber optic cable management trays for the customer removable modules. Developed fiber storage system for excess customer cabling. ► Designed custom rack frames to support 1,300 pounds of equipment. Verified rack frame design by testing and passing Telcordia NEBS Level III for a Zone 4 earthquake. ► Designed & developed custom insertion/extraction mechanism to improve customer handling of equipment. From May 2000 to January 2004 (3 years 9 months) Senior Mechanical Engineer @ Responsible for the overall mechanical design of the I/O subsystem for a large digital cross-connect. Development included design, analysis, verification testing, qualification testing & manufacturing support. ► Design and development of PCBs, backplanes, front panels, card cages, rack level equipment, fiber storage/management and fiber patch panels. ► Planned/performed airflow and thermal tests to verify design. Improved airflow by 24% as part of a redesign. ► Designed fiber optic patch panel and cable management system to retrofit an existing copper product to a fiber optic product.. From June 1996 to May 2000 (4 years) Plano, Tx