DITF Interconnect Technology

Custom Thin Film Interconnect Solutions Thin film interconnect devices manufactured for today’s demanding needs. Servicing the microwave, telecommunications and fiber optic industries for 38 years. DITF's capabilities for high density, low TCR, close thermal tracking and high stability devices are unsurpassed in quality and on time delivery. Metalization and patterning capabilities include high frequency RF circuitry (0.0005” lines & spaces) and thick (up to 0.005”) Cu traces incorporated on the same substrate to reduce footprint and overall package size. Contact the factory with your requirements. Passive Components •Attenuators •Capacitors •Hybrids •Inductors •Resistors Semiconductors/Integrated Circuits •Thin Film Circuits