ALLVIA, Inc. Email Format & Employee Directory
Silicon Through Via (TSV) and Integrated Passive Interposer (IPI) Services
ALLVIA, Inc. offers a full lineup of silicon wafer etching and plating services for applications such as Through-Silicon Via* (TSV) and Integrated Passive Interposers (IPIs).
We offer feasibility, prototype, pre and full production foundry services.
ALLVIA offers efficiency, in-depth expertise and knowledge, and the most experience in the industry.
Contact us today for a solution to your silicon TSV and IPI needs.
ALLVIA, Inc. contact details
Electrical & Electronic Manufacturing