Yi-Shao Lai’s Email & Phone

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Yi-Shao Lai

Co-Chair, 3DS-IC Standards Technical Committee @ SEMI Taiwan

Yi-Shao Lai Contact Details

Co-Chair, 3DS-IC Standards Technical Committee @ SEMI Taiwan
Guest Editor, Journal of Electronic Packaging @ ASME (The American Society of Mechanical Engineers)
Associate Editor, IEEE Transactions on Components, Packaging and Manufacturing Technology @ IEEE
M.S., Civil Engineering @ National Central University

Yi-Shao Lai received the Ph.D. degree in engineering mechanics from The University of Texas at Austin in 2002, and M.S and B.S. degrees in civil engineering from National Central University, Jhongli, Taiwan, of which he was elected Outstanding Alumnus in 2011. Dr. Lai is a Director with Advanced Semiconductor Engineering (ASE), Inc. and an Adjunct Assistant Professor 

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