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Nick VanderStel's email & phone number

FPGA Engineer at DornerWorks Ltd.

Nick VanderStel's Phone Numbers

Nick VanderStel's Work Experience

DornerWorks Ltd.

FPGA Engineer

DornerWorks Ltd.

Embedded Software Engineer

February 2013 to April 2015

Gentex Corporation

Software Test Engineer

November 2010 to February 2013

600 N Centennial St. Zeeland, MI

Nick VanderStel's Education

Grand Valley State University

B.S.E., Electrical Engineering

2007 to 2010

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About Nick VanderStel's Current Company

DornerWorks Ltd.

Frequently Asked Questions about Nick VanderStel

What company does Nick VanderStel work for?

Nick VanderStel works for DornerWorks Ltd.

What is Nick VanderStel's role at DornerWorks Ltd.?

Nick VanderStel is FPGA Engineer

What is Nick VanderStel's personal email address?

Nick VanderStel's personal email address is n****[email protected]

What is Nick VanderStel's business email address?

Nick VanderStel's business email address is [email protected]***.***

What is Nick VanderStel's Phone Number?

Nick VanderStel's phone (313) ***-*345

What industry does Nick VanderStel work in?

Nick VanderStel works in the Electrical/Electronic Manufacturing industry.

About Nick VanderStel

đź“– Summary

FPGA Engineer @ DornerWorks Ltd. Embedded Software Engineer @ DornerWorks Ltd. From February 2013 to April 2015 (2 years 3 months) Software Test Engineer @ Gentex Corporation From November 2010 to February 2013 (2 years 4 months) 600 N Centennial St. Zeeland, MIGVSU Senior Project Team @ Fulton Innovation LLC Wireless Power 3D MouseSenior Capstone I/II for Grand Valley State UniversitySponsored by Fulton Innovation LLCDesigned a wirelessly powered 3D mouse to be used as a demonstration of Fulton Innovation’s eCoupled wireless power technology. Mouse was required to be powered solely by inductive coupling, measure magnetic field strength, and control Google Earth in 3 dimensions. IMU hardware on the mouse consisted of a 3-axis accelerometer, 3-axis gyroscope and magnetic field measurements. AHRS was implemented on a PC. Embedded processing consisted of AVR microcontrollers. Project required working closely with a team consisting of electrical and product design engineering majors. Directly involved with both hardware and software development. From January 2010 to August 2010 (8 months) Electrical Engineering Co-op @ L-3 Communications Avionics Systems Responsibilities included testing avionics equipment software against requirements and designing the methods to do so. This included documenting all of the methods and procedures in preparation for DO-178B certification. The main project involved a platform implemented using a TI DSP and an Altera FPGA. Tests were developed in C using LabWindows and also an in-house scripting system. Required excellent C programming, debugging, document preparation and communication skills. From March 2008 to December 2009 (1 year 10 months) Electrical Engineering Intern @ Shape Corporation Troubleshooting GE PLC-based controls.Design press and feeder controls.Update electrical schematics in AutoCAD. From January 2007 to March 2008 (1 year 3 months)

Nick VanderStel’s Personal Email Address, Business Email, and Phone Number

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Nick VanderStel's Ranking

Ranked #268 out of 5,368 for FPGA Engineer in Michigan

Nick VanderStel's Personality Type

Introversion (I), Sensing (S), Thinking (T), Perceiving (P)

Average Tenure

1 year(s), 8 month(s)

Nick VanderStel's Willingness to Change Jobs



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