Vice President of Automotive Product Line Management @ GLOBALFOUNDRIES
Senior Director of Product Management @ NVIDIA
PxT Team @ Intel Corporation
BSEE, Electrical Engineering @
University of Illinois at Urbana-Champaign
Accomplished professional with deep technical skills across the full spectrum of semiconductor and application processors – from design, architecture, fabrication, manufacturing, validation and customer support. Extensive experience in SOC design, program and product management having held leadership roles in every OMAP processor. Proven history of working with customers on their system and product design. Highly respected for
Accomplished professional with deep technical skills across the full spectrum of semiconductor and application processors – from design, architecture, fabrication, manufacturing, validation and customer support. Extensive experience in SOC design, program and product management having held leadership roles in every OMAP processor. Proven history of working with customers on their system and product design. Highly respected for the ability to lead large developments and yet the ability to drive down into the smallest nuance to get the job done.
Senior Director of Product Management - Tegra @ From September 2013 to Present (2 years 4 months) San Francisco Bay AreaPxT Team @ From February 2013 to September 2013 (8 months) Director - OMAP Platform Product Management @ Responsible for the OMAP Application Processor Roadmap and product definition.
• Successfully ramped the OMAP4 product family at multiple OEM – over 50+ unique tablets and smartphones – including Droid Razr, LG Optimus3D, Galaxy Nexus ICS GED, Samsung Galaxy Tab2, and the Amazon Kindle Fire
• Primary OMAP media spokesperson evangelizing the OMAP4 and OMAP5 family
• Managing a high caliber team in the definition and marketing of the OMAP products From November 2010 to February 2013 (2 years 4 months) OMAP 4 Program Director @ Management of the OMAP4 development including OMAP SOC, Android SW and HW Reference platform.
o Exhibited capability to lead a 400+ person team distributed across 3 continents
o Contributed at both program leadership level as well as hands on technical to drive teams of experts to resolve complex system issues. From April 2009 to March 2011 (2 years) Program Director @ Responsible for the execution of a 3G Platform leveraging TI OMAP3 Application Processors / SW, Custom 3/3.5G BB / SW, and Power Management IC.
• Built “Start Up” organization within TI to define and build a custom 3G Modem SOC – Wrigley3G - building on OMAP3 Architecture as well as TI and Customer 3G IP.
o Drove the architecture with a team of experts from TI and Customer
o Defined ASIC development model to integrate Customer IP into TI model. Aligning RTL, Verification, STA and Physical design and tool flows.
o Drove the execution of the Modem system, SOC and base port SW components From January 2006 to April 2009 (3 years 4 months) OMAP IC Program Manager @ Program Managed the OMAP2420 Application Processor From May 2004 to January 2006 (1 year 9 months) OMAP IC Design Leader @ Lead the design of the OMAP1 products.
o Ex-patriot assignment in TI Nice France R&D Center
o Personally contributing to all aspects - definition, RTL design, Synthesis, STA, Timing Closure, Physical design, IP integration, verification and validation.
o Mentoring the design team and introducing new tools and methodologies to cope with the complexity of large scale SOC design. From November 2000 to May 2004 (3 years 7 months) Field Sales ASIC Designer / Application Engineer @ From April 1996 to November 2000 (4 years 8 months) Product Engineer @ Great starting point in a small company environment enabling exposure to all aspects of semiconductor marketing, design, development, and production – in a short span of time. A great kick start for my career. From January 1993 to April 1996 (3 years 4 months)
MBA, MBA with Marketing Concentration @ DePaul University - Charles H. Kellstadt Graduate School of Business From 1997 to 1999 BSEE, Electrical Engineering @ University of Illinois at Urbana-Champaign From 1989 to 1993 Mark Granger is skilled in: IC, Product Management, Processors, Smartphones, Integrated Circuit Design, Semiconductors, SoC, ASIC, Wireless, Engineering Management, Consumer Electronics, LTE, RTL design, Interpersonal Skill, Cross-cultural Teams
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