Jemmy Sutanto's Email Addresses & Phone Numbers

Principal Engineer @ Medtronic  3+ years (June 2015 – NOW) of experiences as Principal IC Design Engineer at Medtronic, Tempe, AZ Principal Research and Development for implantable MEMS capacitive pressure sensor for heart failure (HF) patients. Design and process development of the capacitive pressure sensors in Coventor and MEMS+; the design include but not limited to...

Principal Engineer @ Medtronic  3+ years (June 2015 – NOW) of experiences as Principal IC Design Engineer at Medtronic, Tempe, AZ Principal Research and Development for implantable MEMS capacitive pressure sensor for heart failure (HF) patients. Design and process development of the capacitive pressure sensors in Coventor and MEMS+; the design include but not limited to electrical domains (capacitance, cross coupling capacitance, and break down voltage) and mechanical domain (stiffness, resonance frequency, and squeeze film damping) Principal IC and FPGA design, targeted for medical equipment – working as a group with senior principal IC designer involvement included but not limited on the design of the cell/physical domains, memory, capacitor either discrete/ embedded/wafer scale of PICS, from Murata; Expert in the MEMS design with heavy involvement in the ASIC design for the sensor and actuation, targeted for medical application, which include for bio sensor and micro/miniaturized drug delivery The inventor and designer for non-magnetic MRI safe shunt valve, for treatment of hydrocephalus (about 200,000 US cases per year), the MEMS actuator design was done using Coventor; Design of the complete packaging in 3D CAD tool;  The inventor and the designer for MEMS micropump for diabetes patents; MRI safe — a simple electromechanical MEMS micropump without rotating component; The designer for 3D packaging and wafer level process development; grounded knowledge for the process flows from A to Z; the Mask designer and also the process flow designer; Manager for 3D Design Environment – Designer of 3D stacks/package, working with the 1st level DE for electrical schematic in Cadence; Tempe, AZSenior Manager @ Amkor Technology  Program Manager of Business Unit for System in Package (SiP) for various applications including Automotive, IoT (Internet of Things), Power Amplifier, and Power Management devices. Specific programs are:MCM (Multi Chip Module) products -- development, qualification, and HVM -- for PA (Power Amplifier) application with Conformal Shielding (CS) on FCBGA/LGA substrate3D die stack SiP with Ag Film Over Wire (FOW) on BGA/LGA substrate with Conformal Shield (CS); Target application: Internet of Things (IoT) Embedded Components in Package for smaller form factor SiP with more functionalities; Target application: Wearable Microelectronics devices From March 2014 to May 2015 (1 year 3 months) chandler, arizonaSenior Manager @ Amkor Technology Technology leader and program manager of CoC (Chip on Chip)/FtoF (Face to Face) program. Brought the CoC –WB (wire bonding) and CoC – WLCSP (Wafer Level Chip Scale Package) into a well-known technology and HVM program at Amkor Technology; 1st CoC (Chip on Chip) – WB (wire bonding) into HVM on PBGA substrates in 2014 for application in the digital microelectronics devices Driving the cost model of the CoC/CoW technology, negotiate with the suppliers for cost reduction, and working with the customers to ramp up the business volume for HVM Low cost and more efficient performance “CoC – WB” is now the “preferred” choice of assembly for automotive applications dropping the initial thoughtful approach of SoC (System on Chip), which is very costly and difficult to realize into HVM.  Low cost and much smaller form factor “CoC – WLCSP” has become the “preferred” approach for MEMS sensors assembly including (oscillator, accelerometer, and gyroscope) and PMIC Design, develop, and validate the process flows for CoW POSSUMTM for high volume manufacturing at high UPH (Units/hours) for low assembly cost of microsensors From January 2012 to May 2015 (3 years 5 months) chandlerResearch Scientist @ Arizona State University  2 years (2009 – 2011) experience as a Research Scientist at Arizona State University – School of Biological and Health systems Engineering, Neural Microsystems Laboratory Manage 2 PhD students and 3 Masters students in the field of Biomedical and Electrical Engineering Obtained NIH/NINDS funding for 3D stacks of MEMS moveable microelectrodes, $ 619,000 Inventor of a novel technology for high aspect ratio solder paste for MEMS packaging (patent pending) Develop a novel 3D stacking technology for MEMS devices with flexible interconnects (patent pending) Develop technique for semi-hermetic sealing for MEMS device; MEMS parts (patent pending) Inventor of the Lorentz force moveable for high density single neuronal recordings for the brain From September 2009 to January 2012 (2 years 5 months) tempe, AZSenior Packaging Engineer @ Intel Corporation  4 years (2006 – 2009) experiences at Intel corporation as Senior Packaging Engineer Working with the component research team to determine the suitable fabrication processes, material selection, and stack-up selections in the silicon back-end layers.  Analyze the packaging processes and their thermo-mechanical impacts in the silicon stack-up reliability. Design Test Chip (TC) and Test Vehicle (TV) that include thermo-mechanical structures to qualify and certify the packaging reliability for upcoming products (in the coming 5 years) Owns the silicon Design Rules (DR) for various product generations; the design rules are primarily for assembly, sort/test, and reliability From March 2006 to June 2009 (3 years 4 months) chandler, AZPostdoctoral Fellow @ Georgia Institute of Technology  1.5 years (2005 – 2006) experiences as a Postdoctoral Researcher in University of Maine and Georgia Institute of Technology in the research areas of BioMEMS and Bioengineering; From June 2005 to February 2006 (9 months) AtlantaPostdoctoral Fellow @ University of Maine From January 2005 to June 2005 (6 months) orono, maine