Jaekyu Song’s Email & Phone

Jaekyu Song Contact Details

Boise, Idaho
Sr. R&D Process Engineer @ Micron Technology
Manager @ Amkor Technology
Bachelor of Technology, Chemical Engineering @ Hongik University

Over 14 years diverse experience in advanced IC packaging development. Hands-on experience in most of critical IC packaging process(dicing, die attach, thermo-compression bonding, wafer bonding/de-bonding, underfill, molding, and etc…), material characterization, failure analysis, design of experiments, and packaging material development. Proven ability in developing advanced IC packaging material & processes including leading edge 3DI/TSV packages. Strong presentation 

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