Image of Hui Geng

Hui Geng

HARDWARE ENGINEER 2

HARDWARE ENGINEER 2 at Microsoft

Irvine, California

Section title

Hui Geng's Email Addresses & Phone Numbers

About Hui Geng

HARDWARE ENGINEER 2 @ Microsoft Bellevue, WASummer Intern @ ITRI Ultra low voltage (ULV) design performance improvement under process variation From July 2013 to September 2013 (3 months) Hsingchu, TaiwanIC Engineer @ Beijing VoiceOn Co, Ltd. I designed an ASIC chip (VPU3010 V2) based on SMIC0.18um technology, and this chip has been successfully taped out in VoiceOn...

Hui Geng’s Personal Email Address, Business Email, and Phone Number

are curated by ContactOut on this page.

Hui Geng's Work Experience

Microsoft

HARDWARE ENGINEER 2

Bellevue, WA

ITRI

Summer Intern

July 2013 to September 2013

Hsingchu, Taiwan

Beijing VoiceOn Co, Ltd.

IC Engineer

March 2010 to July 2011

Hui Geng's Education

Missouri University of Science & Technology

Doctor of Philosophy (Ph.D.), ULV design and S-box security chip

2011 to 2015

Tsinghua University

Master's degree, Electrical and Communication Engineering, 84.62/100

2006 to 2009

About Hui Geng's Current Company

Microsoft

Frequently Asked Questions about Hui Geng

What company does Hui Geng work for?

Hui Geng works for Microsoft


What is Hui Geng's role at Microsoft?

Hui Geng is HARDWARE ENGINEER 2


What is Hui Geng's personal email address?

Hui Geng's personal email address is g****[email protected]


What is Hui Geng's business email address?

Hui Geng's business email addresses are not available


What is Hui Geng's Phone Number?

Hui Geng's phone (213) ***-*704


What industry does Hui Geng work in?

Hui Geng works in the Electrical/Electronic Manufacturing industry.


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